EU Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated  biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).  

National measures restricting or prohibiting the use of these substances in electrical and electronic equipment which were adopted in line with Community legislation before the adoption of this Directive may be maintained until 1 July 2006. 

In addition California has also legislated against the use of Octabromodiphenyl  ether (Octa BDE). 

Flexible Technology Ltd processes and flexible materials do NOT contain any of the proscribed elements with the one IMPORTANT exception of Lead, as tin-lead solder but only when a hot air solder level finish is specifically requested by our customer. 

When does this happen?
The implementation dates may vary across the member states and should be ascertained by the customer

 Where can I get further information?
The DTI web site, includes the latest UK information and useful links.

Flexible printed circuits boards are classed as components and are not included in the requirements of any WEEE legislation.

Finishes are shown with a price rating with 10 being the highest cost

• Electroless Nickel, Immersion Gold. (10)
• Electroplated tin (9)
• Immersion Tin (8)
• OSP (Organic Surface Preservative) (4)
• Organic Silver Preservative (Sterling Process) (2.5)
• Hot Air Solder level Tin/Lead for base line comparison (1)

What about Lead-Free solder finish ?
Flexible Technology Limited has installed equipment that is capable of applying some lead-free solder alternatives. However, please NOTE that there are concerns as to whether the standard coverlays laminated to most flex circuits can withstand, without delaminating, the higher temperature reflow oven profiles required for component assembly with lead-free solders without extra pre-baking. Please consult us about pre-baking as it is dependant on the build construction used.